Federal Information Processing Standards (FIPS) Capabilities
Plasma Ruggedized Solutions offers Level 1-4 Federal Information Processing Standards (FIPS) compliance services, for the protection of high-security information. Our processes will ensure that your hardware meets or exceeds FIPS compliance certification standards for physical security. We also offer guidance in FIPS compliance and support throughout the certification process.
We are one of the highest-volume producers of FIPS-approved products. Based on the security level needed for a particular device, Plasma Ruggedized Solutions can protect your assemblies and circuitry through various methods. We can implement systems that will show evidence of a security break-in or attempted break-in, prevent physical break-ins, and/or respond to these break-in attempts in a number of ways.
FIPS Level 1-2 conformal coating and encapsulation processes will show physical evidence of system tampering, while making it difficult to successfully infiltrate the coated or encapsulated product. FIPS Level 3-4 electronic encapsulation and potting services create much thicker protective barriers, making it nearly impossible to physically tamper with the product in question. Our FIPS processes can also be used to protect products from reverse-engineering.
Plasma Ruggedized Solutions will help you achieve FIPS compliance certification by working with you from the beginning of your design and manufacturing processes. To maximize our security systems, it is important that your product’s design includes allowances for the necessary treatment materials. Our team of experts offers design assistance from start to finish, working with our customers to ensure superior hardware and data protection for FIPS compliance. We also offer FIPS services for ready-made and off-the-shelf assemblies.
As part of our FIPS services, we also offer the ability of in-house testing to ensure proper functionality before and after the electronic encapsulation, coating or potting process. Most products requiring our FIPS services are sensitive to handling and physical tampering, therefore we test them to guarantee the compatibility of the process with the assemblies’ design.
We offer superior FIPS capabilities for any industry where system and data security is of paramount importance. These include military applications, banking, airport security systems, network communications, and many more. We design our FIPS services specifically to match the requirements of each product we work with, creating a solution that includes the ideal material selection and physical controls to give clients the end-product they need. Required parameters often include strict dimensional and quality specifications for the customer’s specific applications. Plasma Ruggedized Solutions will create a design for the product, then evaluate this design with the client. After client approval, a first-article is completed and the finished product is tested for FIPS compliance, physical integrity, proper functionality, and a number of other factors. Additional design adjustments and tests are performed as needed, until an ideal, approved FIPS-compliant product is created.
Plasma Ruggedized Solutions also supports the design, engineering, manufacture and supply of built-in response systems for higher-level products. These built-in systems help increase the security and overall FIPS rating of the products they’re implemented in.
Our FIPS compliance certification services will protect your products and the data stored in them from any potential theft or information probing. FIPS potting/encapsulation, and conformal coating systems prevent access to the data contained within the treated assemblies, and measures can be taken to ensure that further tampering will result in the destruction of the product.
Plasma Ruggedized Solutions constantly strives to achieve ever-greater standards of FIPS capabilities. This continual improvement of our services allows us to reach higher levels of FIPS compliance certification with our electronic encapsulation, potting, and conformal coating services. We are moving forward with new designs for next-generation responsive systems and destructive systems, as well as software designs that will be compatible with, and complementary to, the physical protection aspects of our FIPS services. Some of the advanced-level hardware designs we’re developing include tripwire or breakwire data deletion systems, systems that will respond to temperature changes, systems that can withstand or respond to chemical attacks, and many others. Additionally, Plasma Ruggedized Solutions has worked directly with the US Department of Defense to develop other next-generation lines of security products.
FIPS capabilities are specially designed to protect your data and information from physical tampering and infiltration. We’re an industry leader in the field, and our team of experts will help you design the ideal system for your requirements. Contact Plasma Ruggedized Solutions today for more information about our FIPS electronic encapsulation, potting and conformal coating services.
