Case Studies
Customer requested integration and protection of electronics in a hockey puck. Their main concern was protection, functionality and physical properties/attributes of the device.
FIPS 140-2 Level 3 adds requirements for physical tamper-resistance (making it difficult for attackers to gain access to sensitive information contained in the module).
The circuit board assemblies for this product are mounted to the outside of an aircraft. These assemblies are exposed to different climate conditions, including UV exposure.
Customer board design did not take into account the need for conformal coating and environmental ruggedization needs. Upon applying coating to the boards, customer discovered the boards exhibited migration of the chemistry into areas not targeted.
Customer was using an offshore source to encapsulate their printed circuit board assemblies. At the time the customer contacted PRS they were experiencing field failures, units were non functional, truck lines and factory lines were down.
A customer came to PRS with a Parylene coated PCB. The customer was experiencing field failures due to the extreme environmental conditions.
Customer was using a dip coating method to apply conformal coating to their PCB assemblies. The sharp edges of the surface mount technology (SMT) components and the tip of component leads displayed less than desirable conformal coating coverage.
Customer personnel could not comply with the strict masking requirements and tolerances flowed down from the OEM. Thus causing a significant reduction in stock items and delays in deliveries.
Customer had multiple technical issues with an antenna project. The antennas were presenting field failures withstanding adverse environmental conditions (product was required to operate in 200+ MPH winds while maintaining aerodynamic drag and physical dynamics) and posing certain broadcasting issues.
