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Plasma
Ruggedized
"Please extend our thanks to all Plasma personnel. The support we received from your team during the audit by Harris was great and very much appreciated. Your system and your team performance showed quite readily the high level of support that Plasma provides to its customers and their customers."
-Smart Modular
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Plasma Ruggedized Solutions has provided potting and encapsulation solutions for a wide range of electronic components and assemblies used in demanding environments. From defense and security applications to industrial, transportation and specialty electronics, our processes are designed to protect sensitive circuitry while meeting the specific requirements of each application.
Potting and encapsulation can provide electronics with protection against moisture, dust, chemicals, vibration, shock and other environmental stresses. Depending on the application, Plasma works with materials including epoxy, silicone and high-performance urethanes to develop the appropriate protection for the component and its operating environment.
Our project experience includes protecting circuit boards, electronic displays, cameras, test equipment, power electronics and other assemblies where reliability and durability are critical. In security-sensitive applications, encapsulation can also provide a physical barrier around electronics to help prevent unauthorized access to protected circuitry.
Engineering Solutions for Demanding Applications
Every project presents different requirements. Component geometry, operating environment, material compatibility, thermal considerations, electrical requirements and inspection criteria can all influence the potting and encapsulation process. The projects featured in this gallery represent examples of how Plasma Ruggedized Solutions has applied these technologies to real-world engineering challenges.
Some projects involve highly specialized applications where customer confidentiality limits the amount of information that can be disclosed, but each demonstrates our experience in developing and manufacturing ruggedized electronic assemblies. Explore the projects below to see examples of Plasma's potting and encapsulation capabilities across defense, security, industrial, transportation and other specialized applications.