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Loctite Snap Cure 3563 Underfill

Material Description

LOCTITE® Product 3563 Snap Cure Underfill is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for flip chip devices. It is designed for very high production where process speed is the key concern. This product cures on exposure to heat. It’s rheology is designed to allow it to penetrate gaps as small as 1 mil. This material is easily dispensed, minimizes induced stresses and provides improved temperature cycling performance and excellent chemical resistance.


If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.