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Zymet CN-1533 Underfill

Reworkable CSP and BGA Underfill Encapsulant

CN-1533 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates.

 

If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.