Form-in-place Sealing Compounds: ParPHorm S1936, S1945, L1938

ParPHorm is a family of non-conductive, thermal cure, form-in-place, elastomeric sealing compounds. These silicone and fluorosilicone materials provide environmental, fluid, and dust sealing of small enclosures. The product line consists of state-of-the-art compounds designed to be robotically dispensed onto small housings and then thermally cured. Curing of the dispensed materials is done via in-line ovens at 230o F for 40 minutes. Dispensed bead heights range from 0.018 in. (0.46 mm) to 0.13 in. (3.94 mm). Application advantages of the materials are resistant to a wide variety of fluids, excellent substrate adhesion, low hardness, and outstanding compression set properties.


If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.