Circalok™ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal expansion comparable to that of copper and aluminum. Its strong bond to a wide variety of substrates resists severe temperature cycling. This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves as an electrical insulator; but the semiconductor’s mating surfaces should be precoated with E-343 and allowed to cure to insure the dielectric integrity of the epoxy interface.
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