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Hysol UF3800 Underfill

UF3800™ reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.

 

If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.