Loctite FP4531 Underfill

HYSOL®FP4531: Snap Cure, Fast Flow Underfill

Hysol® FP4531 is a fast flow material for flip chip and CSP underfill applications with a gap of 1 mil or larger. The material is designed to snap cure within 7 minutes at 160°C, even with a preheat application temperature as high as 90°C.


If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.