Loctite FP4531 Underfill
HYSOL®FP4531: Snap Cure, Fast Flow Underfill
Hysol® FP4531 is a fast flow material for flip chip and CSP underfill applications with a gap of 1 mil or larger. The material is designed to snap cure within 7 minutes at 160°C, even with a preheat application temperature as high as 90°C.
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PLASMA
RUGGEDIZED
- CMMC Level 2 Compliant
- Missile Defense Agency (MDA) Certified
- NASA 8739.1A Certified
- NADCAP Electronics Certified