Ball Grid Array (BGA) Underfill Services
CNC Machine Ensures Accuracy and Repeatability
Ball Grid Array (BGA) is a type of surface-mount packaging used for circuit board assemblies and to permanently mount microprocessors and other devices. BGA allows for more interconnection pins than dual in-line or flat packages because the entire bottom surface can be utilized rather than just the perimeter. Since the interconnects are fragile and susceptible to damage from moisture and impact, BGA underfill is used to protect the circuit board assembly by creating sounder thermal and mechanical properties.
Plasma Ruggedized Solutions can underfill any Ball Grid Array (BGA) components, using a variety of encapsulant materials. Our BGA underfill service protects sensitive circuit board assemblies against damage from dropping and other impact hazards. Cell phones, digital cameras, and other equipment that may frequently be dropped knocked around or otherwise unintentionally subjected to severe shock and vibration benefit greatly from this process.
Manual and Automated Underfill Options for Printed Circuits
Plasma Ruggedized Services offers manual and automated BGA underfill processes to give our customers the best possible service. We determine which components of your electronic assembly are potentially sensitive and in need of underfill, then choose the proper encapsulant material and BGA underfill process for your circuit board assembly.
We work closely with our materials suppliers to deliver the best available options, and we’ll help select the ideal materials for your specifications. Our underfill application and curing processes are incredibly adaptable to the needs of the project at hand and can be adjusted and readjusted until we arrive at the perfect process for your PCB assembly application.
Contact us to learn more about manual and automated BGA underfill options for circuit board assemblies.
BGA Underfill Provides a Strong Bond that Protects PCB Assemblies
BGA underfill provides a strong mechanical bond between the BGA component and its connection to the circuit board, protecting the solder joints from physical stress. The underfill material can also aid in heat transfer (CTE) between the BGA component and the board, and in some cases can even serve as the primary heat sink for the component.
Specialized Ball Grid Array Services Using Proprietary Underfill Materials
Plasma ruggedizes Solutions uses a specialized BGA underfill process that employs made-to-order materials in a frozen state to minimize the possibility of contaminants and unwanted variations in the material. These uniquely contained materials are ideal for the precise application requirements of the underfill process.
The BGA Underfill Process
Our BGA underfill process primarily utilizes epoxies as the coating substance, though acrylic and silicone materials are not uncommon as well. Our proprietary underfill material provides superior moisture and thermal cycling performance and provides stable attachment of the component to the PCB. The underfill process is competed in the following steps:
- Underfill is applied either on a corner or in a line along the edge of the BGA or micro CSP
- After application, the BGA/micro CSP is heated to a temperature between 125°C and 165°C
- Capillary action is used to absorb the underfill under the BGA or micro CSP
- The temperature is held steady until the underfill is cured, which can take anywhere from five minutes to an hour or more, depending on the encapsulant material being used
Contact Plasma Ruggedized Solutions for more information or request a quote for ball grid array services.
Solutions for Reworking BGA Underfill and Testing Circuit Board Assemblies
In addition to standard BGA underfill and BGA reballing services, Plasma Ruggedized Solutions can rework PCB assemblies including desoldering or re-soldering printed circuits. Most underfill materials are re-workable, so it is possible for our customers to repair and replace component parts should they fail in the field. The ultimate end goal of our BGA underfill process is to reduce the operating stresses on the unit assemblies and reduce the overall processing time and manufacturing costs.
Using X-Ray Testing to Detect Defects in Your BGA Underfill
Factors including inappropriate equipment, operator error, improper PCB assembly preparing, heat damage and poor profile development can all affect the quality of a BGA underfill. We provide X-ray diffraction testing for BGA circuits and other devices to detect flaws that are not visible on the surface and to determine the overall quality of your circuit board assembly. Common defects or quality issues can include:
- Excessive voids in solder balls
- Open circuits
- Solder ball eccentricity
- Coplanarity between the BGA and PCB assembly
Plasma Ruggedized Solutions uses state-of-the-art equipment and proprietary materials to provide high quality BGA rework, BGA reballing and BGA underfill services for printed circuits and other devices.
BGA Underfill Helps Prevent Damage to Printed Circuits and Electronic Devices
Plasma Ruggedized Solutions’ BGA underfill processes are applicable to a number of products, in addition to BGA components. We also offer underfill services for LGA (land grid array) devices, to account for packaging density and chip scale considerations; CSPs (chip scale packages) to prevent damage due to weight, shock, vibration, etc.; as well as underfill for chip-on-chip devices, quad flat packs, no leads, and many, many others.
As more electronic devices utilize underfill packaging in their manufacture, Plasma Ruggedized Solutions’ continues to be your leading source for BGA underfill services.