Zymet CN-1431 Underfill
Reworkable CSP and BGA Underfill Encapsulant
CN-1431 is a fast flow reworkable underfill encapsulant for CSP and BGA encapsulation and is capable of flowing quickly across distances of 750 mils and greater. It cures rapidly, yet it has a long pot life. Dispensing can be performed with either manual or automatic dispensers.
If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.
PLASMA
RUGGEDIZED
- CMMC Level 2 Compliant
- Missile Defense Agency (MDA) Certified
- NASA 8739.1A Certified
- NADCAP Electronics Certified