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Zymet CN-1431 Underfill

Reworkable CSP and BGA Underfill Encapsulant

CN-1431 is a fast flow reworkable underfill encapsulant for CSP and BGA encapsulation and is capable of flowing quickly across distances of 750 mils and greater. It cures rapidly, yet it has a long pot life. Dispensing can be performed with either manual or automatic dispensers.

 

We are not materials distributors; we do not sell this material. However, if you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.