Loctite 3568

LOCTITE® 3568™ is an epoxy-based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 °C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 °C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.


If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.