Loctite 3568

LOCTITE® 3568™ is an epoxy-based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 °C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 °C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.


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Loctite 3568: Product Information

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).

Handling Information

1. Receiving Frozen Shipments All shipping boxes are packed with dry ice to maintain temperature below -40 °C during transit. Due to the extremely low temperature of dry ice, appropriate care and precautions must be taken during handling operations; thermally insulated gloves should be worn

2. Thawing To prevent introduction of air voids due to thermal shock, a new delivery of material must be maintained at -40 °C for a minimum period of eight hours before further handling. Following this "warming" period, product can be removed from the freezer and allowed to stand at room temperature (22±2 °C) for one hour: cartridges or syringes can then be removed from inner packages and allowed to equilibrate in tip-down orientation at room temperature (22±2 °C) for 1 to 2 hours before use (actual time required will vary with package size/volume).

Do not loosen container lids, caps or covers until equilibration is complete. Heat must never be used as partial polymerization (curing) could occur.

Directions for use

Load product into dispensing equipment. A variety of application equipment types are suitable and include: hand dispense/time pressure valve; auger style valve; linear piston pump and jet valve. Selection of equipment should be determined by application requirements - for advice on equipment selection and process optimization, users should contact their Technical Service Center.

1. Ensure that air is not introduced to product during equipment set-up.

2. For best results, the substrate should be pre-heated (typically to 90 to 100 °C for about 20 seconds) to allow fast capillary flow and facilitate leveling. The dispense nozzle may also be pre-heated (30 to 50 °C maximum) to further increase capillary flow.

3. Dispense product at moderate speed (2.5 to 12.7 mm/s). Ensure that needle tip is about 0.025 to 0.076 mm from substrate surface and from chip edge - this will ensure optimal flow conditions for the Underfill.

4. The dispense pattern is typically "I" along one side or "L" pattern along two sides, focused at the corner. Application should start at the location furthest away from the chip center - this helps ensure a void free fill underneath the die. Each leg of the "L" or "I" pattern should not exceed 80 % of the length of each die edge being dispensed.

5. In some cases second or third application of product may be necessary.

Rework Process

1. Once testing determines that a component is defective, a simple rework procedure is used to replace the defective part. Simply heat the package and underfill to standard rework temperatures to easily remove the defective component from the printed circuit board.

2. An uncomplicated cleanup procedure requiring no solvents or acids prepares the site for a replacement device - gentle high speed brushing eliminates any residue remaining after the defective device is removed. Examination of the boards by IR verifies the cleanup.

3. Thermal cycling tests conducted on the second device confirm that this rework process does not significantly diminish the thermal cycling performance of the replaced device. Thorough testing is always recommended. Do Not return product to refrigerated storage; any surplus product should be discarded

Loctite Material Specification

LMS dated April-10, 2002. Test reports for each batch are available for the indicated properties. LMS test reports include selected QC test parameters considered appropriate to specifications for customer use. Additionally, comprehensive controls are in place to assure product quality and consistency. Special customer specification requirements may be coordinated through Henkel Quality.


Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Product shall be ideally stored at ≤-40 °C. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.


The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

Trademark usage

Except as otherwise noted, all trademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark registered in the U.S. Patent and Trademark Office