Zymet CN-1703 Underfill
Reworkable CSP and BGA Underfill Encapsulant
CN-1703 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates.
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