We are committed to the safety of both our clients and our team amid COVID-19 developments. We are operating per the recommended federal and state guidelines, and are able to help and support your business needs during this time.

Zymet CN-1703 Underfill

Reworkable CSP and BGA Underfill Encapsulant

CN-1703 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates.


If you are interested in formulated materials or custom materials, click here to go to our formulated materials page, and/or contact us directly to discuss your project requirements.