Electronic Potting and Encapsulation
Encapsulated Military Cables
Encapsulated Transformer – Medical Industry
Electronic Potted and Encapsulated Network Circuit Board
Potting and encapsulation deliver a thicker and more robust solution versus conformal coating to protect your electronic assemblies from harsher environments, tin whiskers and to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats, such as tampering or reverse engineering.
The Importance of Potting & Encapsulation
Potting and encapsulation and epoxy coatings also create a barrier against moisture, dust, fungus, and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits and protecting against voltage arcs and short circuits by preventing the formation of tin whiskers.
We offer a variety of available materials for your electronic encapsulation and potting requirements. We offer epoxy, silicone, urethane, and, to a lesser extent, acrylic coatings. Epoxy coatings are ideal for harsh environments and physical security protection and are tailored to the specific needs of your application, including high voltage or thermal concerns. Silicone potting and silicone encapsulation offer superior protection against moisture exposure and use a more forgiving material which protects assemblies from stress and allows for movement. Urethane coatings are also useful in extreme environmental conditions, but aren’t as hard and put less physical stress on the protected assemblies.
Plasma Ruggedized Solutions employs a number of unique processes for electronic encapsulation and potting, and many of our techniques have now become standards throughout the industry. Our fence & fill application creates a containment system directly on the circuit board assembly being coated, to cover only specific areas of the PCB if a complete coating is not needed. This provides a high-quality, low-cost solution for our customers. Plasma Ruggedized Solutions continually strives to remain on the cutting edge of potting and encapsulation technology and techniques, and we are constantly engineering and implementing new innovative methods to give our customers the finest service available. We design and create our own molding systems and fixtures in-house to offer high levels of adaptability for any customer requirements.
FIPS Compliance Services
Since potting and encapsulation can enclose an entire electronic assembly, the procedure can be used to make the circuit FIPS compliant. Electronic encapsulation and potting will protect the assembly from unauthorized entry, modification, and reverse engineering, and any attempt to remove the protective material will destroy the circuit in the process. Plasma Ruggedized Solutions is one of few companies that offer FIPS services, for a variety of applications. Our continuing innovations help us stay at the forefront of this growing sector of the industry.
Potting and encapsulation services offered:
- Custom process development
- Both shell and non-enclosure (fence & fill) applications
- FIPS capabilities
- AQMD compliance
- RoHS compliance
Plasma Ruggedized Solutions is your source for potting and encapsulation services. We can handle any quantity, from first articles to large production quantities. We will help you select the ideal coating material for your electronic encapsulation and potting requirements, to ensure superior performance and long life. Each and every assembly that we work with is inspected and, if necessary, cleaned before coating to guarantee uniform adhesion. And, we rigorously test each assembly at various stages of the process, to verify proper functionality.
Contact Plasma Ruggedized Solutions for Potting & Encapsulation Services
Plasma Ruggedized Solutions is the industry leader in potting and encapsulation. PRS works across industries, providing solutions to a variety of applications.