Heat Ablative Materials and High-Temperature Coatings

Printed circuit boards (PCBs) and other critical electronics can experience high temperatures throughout their lifecycles, which can affect the performance, safety, and reliability of their components. Plasma Ruggedized Solutions is a provider of integrated thermal protection solutions that combine heat-dissipation materials, heat-ablative materials, and high-temperature protective coatings to manage high temperatures and prevent malfunctions or permanent damage.

With proprietary solutions, we develop protective materials for PCBs and electronic assemblies in defense systems, aerospace platforms, marine and subsea environments, and high-power commercial electronics, helping control thermal stress, reduce failure rates, and extend the life of electronic assemblies. Contact Plasma Ruggedized Solutions (PRS) for more information on our capabilities.

The Importance of Heat Dissipation Materials for PCB Assemblies

PCBs and their assemblies require adequate thermal management, and heat-dissipation materials are designed to withstand sustained thermal loads. Ball grid array (BGA) and land grid array (LGA) underfills put out immense heat that will go into the board, leading to:

• Bending and warping, or “potato chipping”
• Cracking barrel and trace components
• Improper electrical connections
• Tiny, hard-to-detect fissures

As critical electronics become smaller and more compact, more heat and radiation are concentrated in a smaller area, which can amplify these issues and lead to failure. For these electronics to perform as intended, underfills are necessary heat-dissipative materials for advanced systems. They are designed to reduce solder fatigue and stress due to the coefficient of thermal expansion, preventing board warping and premature failures.

Kronos-10™

We formulate Kronos-10™, a proprietary underfill solution that is designed to protect internal operational features of PCBs and electronics. This material provides superior thermal conductivity, mechanical reinforcement, and resistance to moisture and thermal cycling, with bonding characteristics to address shock and vibration. To meet your needs for specific threat environments, we also offer a range of additional materials.

Heat Ablative Materials for Intense, Short-Term Thermal Loads

Heat-ablative materials utilize a controlled sacrificial process, in which extreme thermal energy is absorbed through charring, gas release, or intentional material composition. These high-performance compounds slow heat transfer to sensitive internal electronics, delaying thermal penetration. To protect mission-critical systems, heat ablative materials are used across applications, such as:

• Missile and propulsion-adjacent systems
• Fire exposure scenarios
• High-heat transient events
• Battery containment
• Catastrophic protection applications

Combining High-Temperature Coatings with Thermal Materials

Used in conjunction with heat dissipative or heat ablative materials, high-temperature coatings are designed to work with other materials to protect critical electronics. They provide essential structural protection, while the thermal material moves or absorbs heat. During thermal cycling, these materials maintain adhesion and structural integrity, providing a reliable thermal management solution that also resists oxidation, corrosion, flame exposure, and chemical attack.

BGA and LGA Underfill with Heat Management Properties

Underfill services with BGA or LGA can improve heat transfer and structural stability in PCBs. We use manual and CNC-controlled underfill processes for precise application, while utilizing thermal material solutions that incorporate specific thermal cycling and curing protocols to protect against high temperatures and ensure optimal performance, reliability, and safety for critical electronics.

How Integrated Thermal Protection Works in PCBs and Critical Assemblies

Integrated thermal protection embeds thermal management into PCBs and other critical electronics with a layered protection strategy:

• The inner layer features a heat-dissipative underfill for steady-state heat management
• The middle layer is a high-temperature conformal or barrier coating for structural protection
• The outer layer is made of heat-ablative materials for extreme or transient exposure

At the systemic level, the goal is to create a solution tailored to the specific application. With various materials to choose from, each will be evaluated based on its compatibility with the component and the application, as well as its ability to work with other materials used.

Custom Heat Ablative Materials and High-Temperature Coatings for Applications

PRS offers extensive experience in military, aerospace, and marine applications, providing custom heat-ablative materials, heat-dissipative solutions, and integrated thermal protection to meet your needs. With solutions for a wide range of critical electronics, our experts work with you using a consultative approach to select and formulate a complete solution that will protect PCBs and electronics in high-temperature, high-stress environments.

Inspection, Testing, and Rework Services

To support heat-dissipative and heat-ablative materials, we offer inspection, testing, and rework services to ensure the quality and functionality of components, materials, and finished products. From real-time inspection using 2D X-ray diffraction to assess PCBs and assemblies for solder-joint defects and open or short circuits, to thermal diagnostics and mechanical inspection with cross-sectional testing, our services can validate the manufacturing quality of your PCBs. We can also perform BGA reballing, de-soldering, and re-soldering for failed or poorly underfilled components, including rework.

Plasma Ruggedized Solutions is an Experienced Partner in Advanced Electronic Coating

With decades of expertise, PRS is a material formulator and systems integrator, specializing in defense, aerospace, and ruggedized electronics. We offer the capability to tailor unique solutions to environmental and thermal threat profiles, with consultative support from expert engineers, covering material compatibility, application methods, environmental qualification strategies, and inspection, validation, and rework services. To discuss thermal and advanced solutions for your electronics, contact us or request a quote to get started on your project.