Heat Dissipation Materials for PCB & Electronics Protection
Printed circuit boards (PCBs) can experience high temperatures throughout their life cycle, which affects the performance, safety, and reliability of these critical components. Managing high temperatures is crucial, as it can lead to malfunction and permanent damage.
High-performance electronics and PCBs in the defense, aerospace, medical, and commercial industries have increasingly relied on components like BGAs and LGAs that generate high heat loads. Plasma Ruggedized Solutions offers proprietary heat dissipative materials—such as Kronos-10™—and application techniques designed to manage thermal stress, reduce failure rates, and extend the life of your electronic assemblies.
Why Heat Dissipation Matters in PCB Assembly
With the increased use of BGAs, LGAs, and other high-density packages in PCB construction, PCBs are more susceptible to higher temperatures. In high-power applications, as well as specific environments, such as harsh underwater deployments, airborne electronics, and compact, thermally dense commercial assemblies, it is essential to provide PCBs with adequate thermal management because damage from high heat loads can spread to other components, resulting in:
- Board warping or “potato chipping”
- Solder joint degradation
- Quality test failures
Kronos-10™ & Other Proprietary Materials
To manage heat dissipation in PCBs, PRS formulates Kronos-10™, a state-of-the-art underfill material that protects internal operational features of PCBs and electronics. Kronos-10™ is designed for dual-purpose use, providing superior thermal conductivity for heat dissipation and a strong mechanical bond to protect against CTE mismatch. Compared to typical underfill materials that focus solely on thermal performance, our proprietary material offers exceptional moisture and thermal cycling resistance, while also demonstrating bonding characteristics that address shock and vibration. Additionally, we can provide other materials that are tailored to specific threat environments.
BGA & LGA Underfill with Heat Management Benefits
We provide underfill services to improve heat transfer and structural stability in PCBs. Using manual and CNC-controlled underfill options for precise applications, our heat dissipation material solutions incorporate specific thermal cycling and curing protocols to protect PCBs against high temperatures, ensuring their optimal performance, reliability, and safety. The underfill process is completed through the following step-by-step procedure:
- Underfill is applied either on a corner or in a line along the edge of the BGA or micro CSP
- After application, the BGA/micro CSP is heated to a temperature between 125°C and 165°C
- Capillary action is used to absorb the underfill under the BGA or micro CSP
- The temperature is held steady until the underfill is cured, which can take anywhere from five minutes to an hour or more, depending on the encapsulant material being used
Our proprietary material, used for heat dissipation in PCBs and electronics protection, Kronos-10™, can also serve as a substitute for heat sinks in high-temperature components.
Custom Heat Dissipative Solutions for Mission-Critical Applications
With experience in unique military, aerospace, and marine applications, PRS can provide custom heat dissipative solutions tailored to meet your specific application requirements. We offer solutions for continuously operating sensors in submerged or radiation-heavy environments, as well as options to ensure color stability and component adhesion under extreme conditions. Working with you, our experts take a consultative approach to selecting and formulating heat dissipation materials for PCB and electronics protection.
Inspection, Testing, & Rework Services
Supporting our solutions for heat dissipation, we offer inspection, testing, and rework services to ensure the quality and functionality of components, materials, and finished products. From real-time inspection using 2D X-ray diffraction to inspect PCBs and assemblies for solder joint defects and open or short circuits, to thermal diagnostics and mechanical inspection with cross-sectional testing, our inspection and testing solutions validate the manufacturing quality of your PCBs. We also offer BGA reballing, de-soldering, and re-soldering for failed or poorly underfilled components, as well as rework capabilities with proprietary frozen materials to eliminate contamination and ensure the performance of components.
Contact Us About Heat Dissipation Materials to Protect Your Electronics
PRS is a leader in the industry for conformal coating and electronic protection solutions. By formulating proprietary heat dissipation materials for PCBs and electronics protection, we can help ensure the quality, functionality, reliability, and safety of your critical components. Contact Plasma Ruggedized Solutions to discuss heat dissipation solutions to meet your specific requirements, or request a quote to get started.